surface mount chip leds technical data HSMX-C260 features ? reverse mountable smt led ? diffused optics ? small 3.4 x 1.25 mm footprint ? operating temperature range of -25 c to +80 c ? compatible with ir solder ? four colors available: red, orange, yellow, and green ? available in 8 mm tape on 7 in. (178 mm) diameter reels applications ? keypad backlighting ? symbol backlighting ? status indication ? front panel indicator description the HSMX-C260 is a reverse mountable chip-type led for lighting the non-component side of a pc board. in this reverse mounting configuration, this led is designed to emit light through a small cut-out hole in the pc board. the HSMX-C260 is available in four colors. the small size, narrow footprint, and low profile make this series of leds excellent for backlighting, status indication, and front panel illumination applications. device selection guide part number color parts per reel hsms-c260 high efficiency red 3000 hsmd-c260 orange 3000 hsmy-c260 yellow 3000 hsmg-c260 green 3000
2 package dimensions notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. absolute maximum ratings at t a =25 c parameter HSMX-C260 units dc forward current [1] 25 ma peak pulsing current [2] 100 ma power dissipation 65 mw reverse voltage (i r = 100 m a) 5 v led junction temperature 95 c operating temperature range -25 to +80 c storage temperature range -30 to +85 c soldering temperature see ir soldering profile (figure 6) notes: 1. derate linearly as shown in figure 4 for temperature above 25 c. 2. pulse condition of 1/10 duty and 0.1 msec. width. HSMX-C260 3.4 (0.134) 0.3 (0.012) 0.50 ?0.15
(0.020 ?0.006) 1.1 (0.043) polarity cathode
mark 1.1 (0.043) 0.50 ?0.15
(0.020 ?0.006) 1.2 (0.047) 1.25 (0.049) led die diffused
epoxy pc board soldering
terminal
3 optical characteristics at t a =25 c luminous peak dominant viewing color intensity [1] wavelength wavelength angle i v (mcd) @ 20 ma l peak (nm) l d (nm) 2 u 1/2 degrees [2] min. typ. typ. typ. typ. her 2.50 8.0 639 626 170 orange 2.50 8.0 606 604 170 yellow 2.50 8.0 584 586 170 green 4.00 15.0 566 571 170 notes: 1. the luminous intensity, iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. electrical characteristics at t a =25 c forward voltage reverse capacitance thermal color v f (v) breakdown c(pf) resistance @ i f =20 ma v r (v) @ i r =100 m a@ v f =0 v, f =1 mhz r q j-p ( c/w) typ. max. min. typ. typ. her 1.9 2.6 5 8 250 orange 2.1 2.6 5 6 250 yellow 2.1 2.6 5 7 250 green 2.2 2.6 5 6 250 figure 1. relative intensity vs. wavelength. wavelength ?nm her green relative intensity 1.0 0.5 0 500 550 600 650 700 750 yellow orange
4 figure 2. forward current vs. forward voltage. figure 3. luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. figure 5. relative intensity vs. angle. figure 6. recommended reflow soldering profile. figure 7. recommended solder pad pattern. note: 1. all dimensions in millimeters (inches). relative intensity ?% 1.00 0 angle 0.80 0.60 0.50 0.70 0.20 0.10 0.30 0.40 0.90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 1.25 (0.049) 1.4
(0.055) 2.3
(0.091) 1.4
(0.055) 2.2 (0.087) dia. pcb hole 230? max. 10 sec. max. 4?/sec.
max. over 2 min. time temperature 4?/sec. max. 140-160? 3?/sec. max. 01020 40 i f ?forward current ?ma 0 0.4 1.2 1.6 luminous intensity
(normalized at 20 ma) 30 0.8 100 10 1 0.1 1.5 1.7 1.9 2.1 2.3 v f ?forward voltage ?v i f ?forward current ?ma green her orange yellow 0 35 0 20 60 80 100 5 i f max. ?maximum forward current ?ma t a ?ambient temperature ?? 40 15 25 30 10 r q j-a = 600?/w 20 r q j-a = 800?/w
5 figure 8. reeling orientation. figure 9. reel dimensions. note: 1. all dimensions in millimeters (inches). cathode side printed label user feed direction 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00
(2.346 ?0.039) 20.20 min.
( 0.795 min.) 6 ps 178.40 ?1.00
(7.024 ?0.039) 3.0 ?0.5
(0.118 ?0.020) 4.0 ?0.5
(0.157 ?0.020) 5.0 ?0.5
(0.197 ?0.020) 13.1 ?0.5
( 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039)
convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components. notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. figure 10. tape dimensions. figure 11. tape leader and trailer dimensions. 8.00 ?0.30
(0.315 ?0.012) user feed
direction dim. a
(see table 1) 3.50 ?0.05
(0.138 ?0.002) 1.75 (0.069) dim. c
(see table 1) 0.20 ?0.05
(0.008 ?0.002) carrier tape cover tape dim. b
(see table 1) 4.00 (0.157) 2.00 ?0.05
(0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) HSMX-C260 series 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) table 1
dimensions in millimeters (inches) cathode dim. a
?0.10 (0.004) dim. b
?0.10 (0.004) part number dim. c
?0.10 (0.004) end start there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. mounted with
components there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. minimum of
230 mm
(9.05 inch)
may consist
of carrier
and/or
cover tape. storage condition: 5 to 30? c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week baking recommended condition: 60 +/C 5?c for 20 hours. 6
www.semiconductor.agilent.com data subject to change. copyright ? 2000 agilent technologies, inc. obsoletes 5980-1501e 5980-2434e (9/00)
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